MODEL

AFM-15

Type

1503

1504

본딩방식

Termosonoc

Products LED,CMOS Sensor,TCXO,SAW,Opto,High Frequency Devices and so on
Chip

Max:2.5Wx2.5Dx1.0Tmm Min:0.3Wx0.3Dx0.1Tmm (Option:Max7.0Wx7.0Dmm)

Max:2.5Wx2.5Dx1.0Tmm Min:0.3Wx0.3Dx0.1Tmm

Substrate

Max:180Wx120Dx3.0Tmm Min:50Wx50Dx0.3Tmm (Option:Max8inchWafer)

Max:170Wx105Dx3.0Tmm Min:50Wx50Dx0.3Tmm

Mounding Tact Time

0.8sec/chip (including 0.2sec process time) 0.75sec/chp (including 0.2sec process time)
Accuracy

±7um/3σ

Max Load

25N(option:50N, 100N)

Chip Supply 5,6,8,12inch wafer etc. wafer magazine auto loading 5,6inch wafer etc. wafer magazine auto loading
외형 1200Wx1450Dx1650Hmm 980Wx1020Dx1860Hmm
무게 약 1800kg 약 1500kg
제조사

TDK

 

MODEL

AFM-25

Type

 

본딩방식

Heat compression(NCP,ACP,NCF,ACF),C4

Products

Module Opto and so on

Chip

Max:30Wx30Dx1.0Tmm

Min:3Wx3Dx0.1Tmm

Substrate

Max:200Wx120Dx1.6Tmm

Min:50Wx50Dx0.4Tmm

Mounding Tact Time

2.5sec/chip(excluding process time)

Accuracy

±2um/3σ

Max Load

372.4N

Chip Supply

2inch tray etc.

외형

750Wx910Dx1760Hmm

무게

약 1100kg

제조사

TDK